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3D Integration Engineer/Lead

Company: Lever
Location: Union City
Posted on: February 24, 2021

Job Description:

Fathom Radiant is building computer hardware to train neural networks at the human brain-scale and beyond. By combining the complementary strengths of optics and electronics, we have developed a revolutionary interconnect fabric that enables a flexible machine with the network capacity of a supercomputer and unprecedented scalability. Help us construct the future of machine intelligence. Our founding team has previously founded startups with more than $500 million in exits. We are well-funded from investors including Khosla Ventures, Jeff Bezos, and many others. We're seeking a 3D Integration Engineer/Lead with broad experience in III-V and Si CMOS device integration. You will drive Fathom's 3D integration efforts including thermal and mechanical modeling, device processing, wafer and die attach, and post-attach processing, and you will transition the processes from R&D into a high volume manufacturing environment. You will collaborate closely with colleagues from other disciplines (epitaxy, optoelectronics fabrication, optics, IC design, systems integration) to enable novel optoelectronic hardware for machine learning. Areas of contribution

  • Work closely with Fathom Radiant's various technical teams to enable unique and novel optoelectronic-electronic integrated systems
  • Perform thermal, mechanical and electrical modeling to develop device designs optimized for 3D integration of III-V on Si and Si on Si
  • Develop wafer fabrication processes for heterogeneous integration of Fathom's III-V optoelectronic devices to Si CMOS
  • Develop wafer/die attach and related processes including CMP, surface treatment, die attach, subsequent thermal processing, back grinding, and dicing
  • Execute Fathom's heterogeneous integration development in a fabless environment with R&D and high volume manufacturing foundry partners
  • Transition fabrication and integration processes from lab to high volume manufacturing environment, including specification of process control limits and design optimization for yield and reliability
  • Help drive the design and direction of related components of the system, including the design of the optoelectronic devices, Si CMOS, and optics Requirements
    • BS/MS/PHD, or equivalent experience in materials science, electrical, or mechanical engineering or physics
    • Experience with 2.5D or 3D packaging and integration, including wafer fabrication processes for Si CMOS and III-V devices (DRIE, RIE, lithography, ALD, PECVD, plating, CMP, C2W and W2W attach, wet chemical etching, etc.) and back end of line (BEOL) processing
    • Experience with III-V to Si CMOS chip-to-wafer attach processes including low temperature metal-metal bump bonding (e.g. In-In) and hybrid bonding (DBI); thorough understanding of CTE mismatch challenges and solutions
    • Experience with TSVs and high-density Si-Si interconnect technologies
    • Experience with mechanical, thermal and electrical modeling tools, such as COMSOL or ANSYS
    • Experience with advanced dicing technologies such as stealth dicing and/or plasma dicing
    • Experience developing and optimizing processes with contract fabrication/manufacturing partners Preferred
      • Experience with heterogeneous integration of optoelectronic device arrays to Si CMOS (e.g. VCSEL arrays, focal plane arrays, uLED arrays, etc.)
      • Experience with semiconductor processing and heterogeneous integration in a manufacturing environment, including an understanding of statistical process control, yield analysis, reliability testing and accelerated aging, and process qualification
      • Familiarity with ESD requirements and procedures for die attach to Si CMOS
      • Experience with failure analysis and materials characterization
      • Demonstrated success bringing devices from R&D to market utilizing a contract manufacturing ecosystem You'll do well here if...
        • You enjoy thoughtful discussions fueled by problem-solving and logic
        • You're comfortable both leading and contributing individually
        • You're self-motivated
        • You can rapidly adjust to changing requirements when needed, and you thrive in a dynamic environment
        • You're organized and able to drive multiple projects forward simultaneously
        • You're excited about the future of ML hardware
        • You enjoy teaching and learning from an interdisciplinary team We highly encourage submission of a cover letter, just tell us why you're here :)

Keywords: Lever, Union City , 3D Integration Engineer/Lead, Engineering , Union City, California

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