Thermal Field Application Engineer
Company: Foxconn-PCE Technology
Location: Santa Clara
Posted on: February 16, 2026
|
|
|
Job Description:
Job Description Job Description Company Overview: Established in
Taiwan in 1974, Hon Hai Technology Group, commonly known as
Foxconn, is the world’s largest electronics manufacturer and
leading provider of technological solutions with a network of over
200 campuses across 24 countries. In the US, Foxconn employs 6,500
across 40 different sites with manufacturing operations in
Virginia, Wisconsin, Ohio, Indiana, Texas and California. As of
2023, Foxconn ranks 32nd among the Fortune Global 500 and reported
a revenue of approximately USD $213 billion in 2024. The company’s
diverse product offerings span four major segments: smart consumer
electronics, cloud and networking solutions, computing and various
other components. Foxconn makes 40% of the consumer electronics
that we find in our everyday lives. In recent years, Hon Hai has
adopted the 33 strategy, focusing on three emerging industries -
electric vehicles, digital health solutions, and robotics - while
leveraging three key technologies: next-generation communications,
artificial intelligence (AI), and semiconductors. Together these
initiatives position the company as a leader for innovation in the
21st century. Hon Hai Technology Group is deeply committed to
championing environmental sustainability within its manufacturing
processes. By integrating sustainability into its operations
framework, the company strives to serve as a best-practice model
for global enterprises, enhancing corporate responsibility while
meeting the growing demand for environmentally conscious
productions methods. Job Summary: The primary function of the
Thermal Field Application Engineer is to provide technical support
for customer design and engineering teams, support integration and
application of the company’s products in customer environments.
This role acts as a bridge between R&D and client-facing
functions to support successful product design, deployment, and
ongoing performance. Duties and Responsibilities: Provide technical
support to customers on liquid-cooling modules, liquid cooling
systems, cold plates, manifolds, and related components. Work
closely with customers to understand system requirements and
provide tailored technical proposals and product recommendations.
Lead technical discussions, design reviews, and troubleshooting
during product evaluation and deployment. Collaborate with internal
R&D, manufacturing, and quality teams to ensure alignment on
design specifications and validation plans. Support customer
samples, testing coordination, and on-site issue resolution
(including possible travel to customer facilities). Assist in
preparing technical documents such as specifications, test reports,
presentations, and failure analysis summaries. Collect customer
feedback and market trends to provide input for future product
development. Support business development teams with technical
insights during customer engagement. Education: Bachelor’s degree
or above in Mechanical Engineering, Thermal Engineering, Electrical
Engineering, or related fields. Experience: 3 years of hands-on
experience in liquid cooling, or thermal solution engineering,
ideally in the data center, server, or semiconductor industry.
Experience with thermal simulation tools or test instrumentation is
a plus. Preferred experience working with hyperscale data centers,
server OEM/ODM, or advanced cooling module suppliers. Preferred
knowledge of large-scale thermal system integration and validation
processes. Preferred familiarity with manufacturing processes
related to cold plates, tubing, and liquid cooling modules. Other
Requirements: Solid understanding of heat transfer principles and
liquid cooling system design. Strong problem-solving abilities with
the capability to perform root cause analysis. Excellent
communication skills and ability to work directly with customers.
Willingness to travel domestically and internationally as needed.
Fluent in English and Mandarin. EEOC Statement Foxconn is an equal
opportunity employer that is committed to diversity and inclusion
in the workplace. Foxconn prohibits discrimination and harassment
of any kind and provides equal employment opportunities (EEO) to
all employees and applicants for employment without regard to race,
color, gender, religion, sex, sexual orientation, ethnicity or
national origin, age, disability, marital status, genetics,
pregnancy, or any other protected characteristic as outlined by
federal law. In addition to federal law requirements, Foxconn
complies with applicable state and local laws governing
nondiscrimination in employment in every location in which the
company has facilities. This policy applies to all terms and
conditions of employment, including recruiting, hiring, placement,
promotion, termination, layoff, recall, and transfer, leaves of
absence, compensation, and training.
Keywords: Foxconn-PCE Technology, Union City , Thermal Field Application Engineer, Engineering , Santa Clara, California
